Next-Generation Bluetooth Low Energy Chip from STMicroelectronics Boosts the Boom of Connected Smart Things

Geneva, June 28, 2017 – The new-generation Bluetooth® Low Energy (BLE) System-on-Chip from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is set to accelerate the spread of connected smart objects throughout homes, shopping areas, industry, toys and gaming, personal healthcare and infrastructure.

more ...

Bourns Honors Arrow Electronics as North American Broadline Distributor of the Year

RIVERSIDE, Calif., June 27, 2017 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced it has named global technology solutions provider Arrow Electronics as its 2016 North American Broadline Distributor of the Year and honored Arrow with a “35 Years of Service” award. Bourns recognized Arrow for its implementation of lean six sigma practices that attracted an increasing customer base for Bourns® products, which resulted in outstanding year-over-year sales growth.

more ...



Vishay Intertechnology RCWK0306 Thick Film Chip Resistors Deliver Increased Accuracy While Saving Space and Reducing Component Counts

MALVERN, Pa. — June 26, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of thick film surface-mount chip resistors featuring four-terminal Kelvin connections and high power ratings of 0.33 W in the compact 0306 case size. Offering a power density over 3.3x higher than standard devices in the 0603 footprint, Vishay Dale RCWK0306 series resistors are designed to save space and reduce component counts in telecommunications, computer, industrial, and consumer applications.

more ...

Bourns Awarded a Best Supplier of 2016 by SPDEI, the French Association of Electronic Components Distributors

RIVERSIDE, Calif., June 21, 2017 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced it has received a Best Supplier of 2016 Award from Syndicat Professionnel de la Distribution en Electronique Industrielle (SPDEI), the French association of electronic components distributors. The award was given to Bourns as one of the four top suppliers of passive components supporting the French market. The SPDEI award acknowledges suppliers based on five key criteria that include partnership with distributors, technology and service innovation, profitability for distributors, allocating resources and providing protection and traceability of design. For 70 years, Bourns has provided the ground-breaking technologies necessary to solve tough design challenges offering one of the industry’s broadest lines of circuit protection, circuit conditioning and motion control products.

more ...

Vishay Intertechnology True Green LEDs in Tiny SMD 0603 ChipLED Package Increase Design-in Flexibility, Enable Smaller End Products

MALVERN, Pa. — June 21, 2017 — The Optoelectronics group of Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of true green LEDs in a compact surface-mount 0603 ChipLED package. Measuring 1.6 mm by 0.8 mm with an ultra thin 0.55 mm profile, the VLMTG1400 series devices utilize the most recent ultrabright InGaN chip technology to achieve industry-high luminous intensity up to 2,800 mcd.

more ...

AMPHENOL RF APPOINTS ENGLISH TECHNICAL SALES IN SOUTHERN CALIFORNIA

Danbury, CT - Amphenol RF is pleased to announce the addition of English Technical Sales as its Southern California manufacturer’s representative. English Technical Sales brings over 40 years of experience and an excellent history of delivering best in class engineering and technical expertise to secure print positions for world leading manufacturers. Their sales force focuses on responding to the evolving trends in the industry and are trained in the technical specificity of the product lines they support.

more ...

New MOST Technology Intelligent Network Interface Controller Enables Daisy-Chain Communications in Automotive Applications

CHANDLER, Ariz., June 20, 2017 — The newest MOST150 Intelligent Network Interface Controller (INIC) from Microchip Technology Inc. (NASDAQ: MCHP) enables automotive manufacturers and tier one suppliers to incorporate Media Oriented Systems Transport (MOST®) networks in a daisy-chain configuration on coaxial physical layer with the support of full-duplex communication, in addition to a ring topology. With a full-duplex daisy-chained network, a single cable segment is sufficient to connect two adjacent devices in the network, reducing cables and connectors for the back channel on each network connection. It also eliminates the return wire connecting the last node of the network to the first. This reduces wiring and component count resulting in lower system costs as well as potential weight savings that can impact Corporate Average Fuel Economy (CAFE) goals and other fuel efficiency regulations.

more ...

Statement from Supervisory Board of STMicroelectronics

Amsterdam, June 20, 2017 – Following the conclusion of the STMicroelectronics N.V. (NYSE: STM) Annual General Meeting, which took place today in Amsterdam (the Netherlands), the members of the Supervisory Board appointed Mr. Nicolas Dufourcq as the Chairman and Mr. Maurizio Tamagnini as the Vice-Chairman of the Supervisory Board, respectively.

more ...