Latest Single-Wire Serial EEPROM from Microchip Enables Remote Identification

CHANDLER, Ariz., Nov. 8, 2017 — A single-wire, two-pin Electrically Erasable Programmable Read-Only Memory (EEPROM) device with a 2.7V to 4.5V operational voltage range is now available from Microchip Technology Inc. (NASDAQ: MCHP). The AT21CS11 is ideal for identifying and authenticating remote items, such as cartridges or cables, where space for electronic components is limited.

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TE Connectivity Keeps Data Moving on the Race Track

November 15-17, 2017 TE Connectivity Booth #3052, Hall 10.1 Koelnmesse — Cologne, Germany. Both on the road and on the race track, tracking speed is no longer enough. Data is key in motorsports, and cars generate a lot of data. Engineers use this critical information to determine how to service a vehicle. In addition, data about oil temperature, pressure and more can help determine the health of a vehicle. TE Connectivity's connectors and sensors help translate this information to track-side engineers, instantly.

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See the latest connectivity solutions to deliver safer, more efficient connected aircraft

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at the 2017 Dubai Airshow to discover how TE is enabling the next generation of connected aircraft to be safer and more efficient. As commercial aircraft become more connected than ever, TE is focused on developing connectivity technologies that reduce size and weight while meeting the demands for higher bandwidths and increased data transfer rates. Designed to perform reliably in the harsh environments of modern aircraft, these technologies are used to control and manage communications and on-board computers for navigation, power management, and multiple subsystems throughout the aircraft.

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Vishay Intertechnology FRED Pt® Ultrafast Rectifiers in SlimDPAK Save Space, Increase Power Density, Improve Thermal Performance

MALVERN, Pa. — Nov. 6, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced 13 new 200 V and 600 V FRED Pt® Ultrafast recovery rectifiers in the eSMP® series SlimDPAK (TO-252AE) package, each available in Automotive Grade and commercial / industrial versions. Offering lower profiles and better thermal performance than devices in the DPAK (TO-252AA), the Vishay Semiconductors rectifiers deliver high power density and efficiency for automotive and telecom applications.

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The Most Powerful Boards DFI Ever Had With Intel® Xeon® Processor Scalable Family

Today DFI announced its newest development in industrial motherboard with the groundbreaking Intel®Xeon® Processor family (Purley). It can fit into demands that require heavy business workloads with high agility, reliability, and security. Intel claims the new processor family is the “biggest platform advancement”, and it supports brand-new memory architecture and accelerat es technology. This powerful platform marks the next level of industrial computer, bringing out unparalleled performance and increased computing capability at extremely low latencies while providing improved reliability and high-throughput data communication.

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Bourns Releases New High-Speed CANbus Protectors for Automotive and Industrial Applications

RIVERSIDE, Calif., October 31, 2016 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today released the company's new high-speed AEC-Q101-qualified Controller Area Network (CAN) protector. Bourns designed its latest surge protection device to protect against damage from transient voltage events such as electrostatic discharge (ESD), interruption of inductive loads or lightning strikes. Ensuring reliable high-speed communications transmission in harsh environments helps systems developers improve reliability in a broad range of automotive and industrial applications that include control networks, Smart Distribution Systems (SDS), DeviceNet™ and factory and process automation systems.

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Vishay Intertechnology Extends Temperature Range of HOTcap® K…H Series Automotive Grade MLCCs to an Industry-High +200 °C

MALVERN, Pa. — Oct. 30, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has extended the operating temperature range of its HOTcap® K…H series of Automotive Grade, radial-leaded multilayer ceramic chip capacitors (MLCCs) to +200 °C — the industry's highest for Ceramic Class 2 through-hole devices. The Vishay BCcomponents leaded MLCCs are now approved for operation over a temperature range of -55 °C to +200 °C for 500 hours, and they provide unlimited operation to +175 °C. The devices combine their high temperature performance with a wide capacitance range from 100 pF to 1 μF and low capacitance tolerances as tight as ± 5 %.

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AUsing Ethernet Magnetics for Improved Industrial Networking Design

Today’s industrial organizations thrive through connectivity. Staying on top of demand and optimizing production towards a more efficient and competitive solution by seamlessly sharing data across every system, from field level instrumentation to enterprise wide systems that can monitor and control plant operations. As an inherent result, increased data flow through these networks has caused concern for industrial corporations about how much longer today’s industrial networks and devices will be able to cope with the increasing demand of information. More and more Industrial networking product designers are implementing Industrial Ethernet solutions that allow for increased bandwidth, noise suppression, and safety isolation to support the future industrial networks.

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AVX Announces Limited-Release Energy Harvesting Applications Design Kit

FOUNTAIN INN, S.C. (October 25, 2017) - AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, announces the limited release of its new Energy Harvesting Application Design Kit. The kit features a wide range of low-loss components hand-selected to provide engineers with ideal solutions for energy storage, blocking, IC support, output filtering, and external connections in thermoelectric generators, solar cells, piezoelectric devices, and micro wind turbines, including: MLCCs, supercapacitors, Schottky diodes, inductors, and connectors. It also comes with a booklet that provides users with a brief introduction to energy harvesting and additional information about the components it contains.

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