Micron Technology Completes Acquisition of Inotera Memories of Taiwan

Micron Technology, Inc. (NASDAQ:MU) today announced that it has completed the acquisition of Inotera Memories, Inc. Micron acquired all of Inotera's outstanding shares for consideration worth 30 New Taiwan Dollars per share or approximately $0.94 USD per share. This represents a transaction value of approximately $4.0 billion, net of cash and debt at Inotera, to acquire the equity not already owned by Micron.

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Miniature Multi-Sensor Module from STMicroelectronics Jumpstarts IoT and Wearable Designs

STMicroelectronics’ 13.5mm x 13.5mm SensorTile is currently the smallest turnkey sensor board of its type, containing a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone. With the on-board low-power STM32L4 microcontroller, it can be used as a sensing and connectivity hub for developing products such as wearables, gaming accessories, and smart-home or Internet-of-Things (IoT) devices.

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Vishay Intertechnology vPolyTan™ Low-ESR Polymer Capacitors Increase Volumetric Efficiency to Lower Component Counts

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of vPolyTan™ multi-anode polymer surface-mount chip capacitors that delivers increased volumetric efficiency for computing, telecom, and industrial applications. Combining polymer tantalum technology with Vishay's patented multi-array packaging (MAP), the T59 series delivers the industry's highest capacitance density while maintaining best-in-class ESR.

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Analog Devices and China Electric Power Research Institute Collaborate to Improve Reliability of Smart Substations

Analog Devices, Inc. (ADI) today announced a collaboration with the China Electric Power Research Institute (CEPRI) to improve reliability of smart substations, the “nerve centers” of modern electrical grids. New electronics and sensor technologies are enabling resilient and flexible grids to meet the evolving needs of how energy is generated, distributed and consumed. The ADI-CEPRI team will engage in joint laboratory and field research to drive innovations advancing the reliability of smart substations.

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Digital PMBus™ compliant PoL converter with Dynamic Loop compensation to power FPGAs, ASICs, and Processors

Murata introduces the OKDL-T/60-W12, a 60 Amp, 94.9% efficient addition to the Murata Power Solutions OKD family of digitally controlled point of load (PoL) DC-DC converters. The OKDL-T/60-W12 power module is ideally suited for FPGA and processor applications. The module is specified to operate over a Vin range of 4.5V to 14Vdc, and provides a user adjustable output in the range of 0.6V to 1.8VDC with an industry leading efficiency of 94.9%. The SMT/LGA module measures just 25.1 x 14.1 x 7.0mm, providing industry leading-power density for the most demanding applications.

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Powering the Future of Motorsports Through Formula E

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at Performance Racing Industry (PRI) 2016 – Yellow Hall, Booth #3625 – to learn how TE is advancing autosport connectivity technologies and pushing innovations to challenge the future of the racing industry.

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Stackpole Adds High Power 0201 Size Chip Resistor

The RMCP series from Stackpole is a thick film chip resistor series with high power ratings for a given chip size. Stackpole recently added an 0201 size chip resistor with a power rating of 0.063W while the usual power rating for this size is 0.050W. This high power capability allows the RMCP0201 to be used in a wider range of applications requiring small size to power ratio such as handheld and portable electronic devices, industrial automation, controls, and robotics.

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TE Connectivity Launches Press-Fit Board Stacking Connector

TE Connectivity (TE) (NYSE: TEL), a world leader in connectivity and sensors, recently released its press-fit stacking connector, a 56-position VPX footprint-compatible connector designed for rugged, high speed applications. Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging.

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Vishay Intertechnology to Highlight Latest Grid and Ribwound Resistors at POWER-GEN International 2016

Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company will be exhibiting its latest grid and ribwound resistors for oil and gas, industrial, and renewable energy power systems at POWER-GEN International® 2016, the world's largest power generation event. Taking place Dec. 13-15 at the Orange County Convention Center, in Orlando, Florida, Vishay will be highlighting the Vishay Milwaukee GRE1 and GRE2 series of high-power, high-current grid resistors, RBEF / RBSF series of ribwound resistors, and NGR series of neutral ground resistors in booth 5539.

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Audio Software from Silicon Labs Strikes the Right Note for Automotive Radio Market

Silicon Labs (NASDAQ: SLAB) has introduced new audio software products that give automotive radio developers greater flexibility to incorporate advanced audio post-processing algorithms in Silicon Labs’ Global Eagle Si47911/12 radio ICs with audio system devices. The new software products make it easy and cost-effective for developers to implement audio post-processing functions such as tone control, cabin equalization and chime generation using the Si47911/12 ICs’ integrated Tensilica HiFi EP DSP. Developers can use Silicon Labs’ development tools to port their proprietary audio algorithms, design custom audio processing flows using Silicon Labs’ library of audio functions, or combine their audio algorithms with Silicon Labs’ audio post-processing functions.

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