Mesh Networking Module from Silicon Labs Simplifies Thread and ZigBee Connectivity

Silicon Labs (NASDAQ: SLAB) has introduced a new family of Wireless Gecko modules focused on mesh networking applications with support for best-in-class ZigBee® and Thread software. Silicon Labs’ new MGM111 module is the first in this comprehensive family of multiprotocol modules based on the Mighty Gecko system-on-chip (SoC) device. The MGM111 module is supported by Silicon Labs’ reliable, secure and flexible mesh protocol stacks and the industry’s most advanced wireless software development tools.

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AAEON Technology EMB-Q170C: A Robust Drive for High Volume NAS with 6Gb/s Through-Put

Powered by Intel® 6th Generation Core™ i7/i5/i3 processor in LGA1151 socket with Intel® Q170 Chipset, the EMB-Q170C delivers high performance to fulfill a full range of industrial applications, such as NAS (Network Attached Storage), POS, ATM and digital signage. Additionally, scalable interfaces and I/Os enhance the EMB-Q170C’s compatibility and connectivity.

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Improve Digital Support of Battery Charging and DC-DC Conversion Applications with New Digitally Enhanced Power Analog Controllers from Microchip

A new Digitally Enhanced Power Analog (DEPA) controller designed to regulate current, regulate voltage and monitor temperature is now available from Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. The device improves digital support for battery charging and is ideal for DC-DC conversion in server, consumer, industrial and automotive applications.

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TE Connectivity’s Raychem ruggedized cable combines performance and space savings

TE Connectivity Ltd. (TE) (NYSE: TEL), a world leader in connectivity and sensors, announced today that its new Raychem high-speed data transmission cables for IEEE 1394 applications. Designed for use with military ground, military and commercial aerospace and marine systems, the ruggedized cable helps block out excess noise in harsh environments to enable dependable signal integrity in extreme conditions.

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Faster, Easier Simplicity Studio Software from Silicon Labs Sets the Pace in Wireless IoT Design

Silicon Labs (NASDAQ: SLAB) has released a major update of its award-winning Simplicity Studio™ software development tools. The new Simplicity Studio release represents a significant redesign of the software infrastructure, making the tools faster to download and easier to install and use. A more intuitive user interface improves the overall developer experience. As the industry’s most comprehensive software tool set for Internet of Things (IoT) connected device applications, Simplicity Studio is the only embedded development environment that broadly supports 8- and 32-bit microcontrollers (MCUs), multiprotocol and multiband wireless SoCs, and fixed-function devices.

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Panasonic Pyrolytic Graphite Sheet

Thermal management has long been a battle waged by design engineers. As the size of devices are decreasing, with power consumption increasing, the common methods of heat transfer are failing to meet today’s designs.

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Stackpole's 0603 X 4 Chip Arrays Now AEC-Q200 Qualified

Stackpole has completed AEC-Q200 testing for the RACF and RAVF series thick film chip resistor arrays in its most popular size, the 0603 by 4 resistors. Per AEC-Q200, these chip resistor arrays must have an operating temperature range of -55°C to +150°C and survive a wide range of electrical and mechanical stress tests including exposure to high temperatures, temperature cycling, high temperature operational life, biased humidity, ESD, board flex, and terminal strength. Components qualified to AEC-Q200 provide engineers additional assurance that they are designing in a robust and reliable component.

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