The demand for small form factors for space-constrained embedded application is increasing rapidly. In response to this requirement, DFI gladly introduces you to ultra-small size products which includes industrial motherboards and system-on-modules based on the new generation Intel® Atom™ processor E3900 series (code name: Apollo Lake). Compared to the last generation Atom (N3700 Series), the brand new DFI product family supports harsh environments and narrow space operations with 30% higher performance and impressively optimized energy efficiency. These products are ideally designed for IoT, automation, transportation, and medical applications.
Rugged Design and Energy-Efficiency for Deeply Embedded Applications
Based on Intel® Atom™ Processor E3900 Series
DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized,fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.
Wide Operating Temperature
These products are able to survive under a wide -40°C to +85°C operating temperature range. Satisfying the demands of industries in harsh environments with the need of thermal solution designs. Also, this outstanding fanless design makes awesome system integration.
Energy Saving but High Performance
With the latest processor under Goldmont architecture, these boards offer 30% significant improvement for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy.
Experience Clarity with 4K UHD High-Resolution
The new series powered by enhanced graphic engine from hardware decoding of HEVC and VP9 codecs supports 4K high resolution (DP: 4096x2304 @ 60Hz) and three independent displays for medical and multimedia solution.