Bourns Releases New Sulfur-Resistant, AEC-Q200 Compliant Thick Film Chip Resistors

RIVERSIDE, Calif., November 20, 2017 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today released two new series of thick film chip resistors that offer enhanced power ratings up to 2 W at 70 °C. The Bourns® Models CRMxxxxA and CRSxxxxA are sulfur-resistant and AEC-Q200 compliant making them well-suited for automotive driver assistant, information, entertainment and lighting applications, as well as commercial, automation, industrial, power supply and stepper-motor drive designs.

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Increase Rugged and Reliability to Your IoT Gateways

DFI’s EC800-AL embedded system is powered by the energy-efficient Intel Atom® Processor E3900 tailored to IoT gateways with the recent increasing demand. It’s a new member of DFI’s compact system product line series. This new model keeps the fanless design in an ultra-small size, supporting 15-years long life cycle while providing enhanced computing, graphics performance, and expandability when compared to the former generation.

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Protect IP and Deploy Secured Connected Systems with Microchip’s New CryptoAuthentication™ Device and Security Design Partner Program

CHANDLER, Ariz., Nov. 20, 2017 — From remote cyber-attacks to the creation of counterfeit products, security threats are wide-spread and affect all industries. When carried out, these threats can translate into substantial losses in service revenue, recovery costs and, perhaps most significantly, in brand equity. Implementing robust security into new and existing designs to protect Intellectual Property (IP) and enable trusted authentication of connected devices is critical. To protect against these threats, Microchip Technology Inc. (NASDAQ: MCHP) has created the ATECC608A CryptoAuthentication™ device, a secure element that allows developers to add hardware-based security to their designs. Microchip has also established a Security Design Partner Program for connecting developers with third-party partners that can enhance and expedite secure designs.

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Vishay Intertechnology's T59 Series of vPolyTan™ Low ESR Polymer Capacitors Among 2017 ECN IMPACT Award Winners

MALVERN, Pa. — Nov. 20, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that its T59 series of vPolyTan™ multi-anode polymer surface-mount chip capacitors was among the winners of the 2017 ECN IMPACT Awards. The awards program, sponsored by ECN Magazine, recognizes the top products and services across 18 categories spanning the design and engineering landscape. In the category of "Passive Components & Discrete Semiconductors," Vishay's T59 series was selected as a winner for the increased volumetric efficiency it provides for computing, telecom, and industrial applications, which reduces component count, saves PCB space, and lowers overall solution costs.

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Statement from STMicroelectronics, following Moody’s upgrade to Baa3

We anticipate 18% revenue growth this year (at the midpoint of our Q4 guidance), and in the third quarter we expanded our operating margin to 13.7% and net earnings to $236 million, which represented our record level for the past 15 years. Moreover, we strengthened our capital structure with the $1.5 billion new convertible bond issued in July 2017 at zero cost. Moody's decision reflects these results and, importantly, their sustainability over time.

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Bourns New Trimming Potentiometers Offer Significantly Lower CRV and Improved Linearity for Sensitive Microprocessor Designs

RIVERSIDE, Calif., November 14, 2017 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced high reliability precision Trimpot® trimming potentiometers that provide more accurate linearity, lower Contact Resistance Variation (CRV) and can be customized to a customer's exact requirements. Based on the company's continued innovation and 70-year history of engineering, Bourns designed its new precision Trimpot® products for use with microprocessors or in applications where precise adjustment is needed.

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TE Cable Assemblies Minimize Cost, Speed Time to Market for Virtual Reality Startups

HARRISBURG, Pa. – November 16, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced a line of virtual reality (VR) cable assemblies that speed time to market and offer superior performance compared to other solutions in the market. TE’s cable assemblies for VR applications enable VR solution providers to get to market faster with a proven platform design that can be easily and quickly modified to address their needs. TE can provide the entire cable assembly and high-speed receptacle, or just the plug modules if the cable is sourced from another supplier. The low-profile receptacle saves valuable printed control board (PCB) space in the headset, while the use of equalizers within the connectors on the cable assembly extends the reach of thin cable, keeping cable weight low.

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TE Connectivity Cable Assemblies Reduce Risk, Speed Time to Market for VR Startups

HARRISBURG, Pa. – November 16, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced a line of virtual reality (VR) cable assemblies that speed time to market and offer superior performance compared to other solutions in the market. TE’s cable assemblies for VR applications enable VR solution providers to get to market faster with a proven platform design that can be easily and quickly modified to address their needs. TE can provide the entire cable assembly and high-speed receptacle, or just the plug modules if the cable is sourced from another supplier. The low-profile receptacle saves valuable PCB space in the headset, while the use of equalizers within the connectors on the cable assembly extends the reach of thin cable, keeping cable weight low.

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STMicroelectronics Showcases Advanced Robot Demo and Latest Solutions for Embedded Systems at Embedded Technology 2017

Tokyo, November 14, 2017 - With the Internet of Things (IoT) becoming a part of people's lives, network-connected embedded systems are growing more important than ever. STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will showcase its latest solutions for embedded systems, including a robot demo composed of a range of ST products, at Embedded Technology 2017 (ET2017).

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