Increase Software Power Measurement Accuracy to 99 Percent in Windows 10 Devices with New Power Monitoring IC from Microchip

CHANDLER, Ariz., Sep. 19, 2017 — The PAC1934, a precision power and energy monitoring chip, is now available from Microchip Technology Inc. (NASDAQ: MCHP). The chip works in conjunction with a Microchip software driver that is fully compatible with the Energy Estimation Engine (E3) built into the Windows 10 operating system to provide 99 percent accuracy on all Windows 10 devices that have batteries. Combining Microchip’s PAC1934 and Windows 10 driver with Microsoft’s E3 service can improve the measurement of battery usage from different software applications by up to 29 percent.

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TE Connectivity Provides High Speed Connections for OnTime Networks

HARRISBURG, Pa. – September 19, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, and OnTime Networks (OnTime) are pleased to announce their collaboration in the release of OnTime’s new Cloudberry MIL/AER CM/CR-6200 series rugged ETHERNET switch, router and network time server. Each CM/CR-6200 switch/router/network time server utilizes up to twelve CeeLok FAS-T connectors, providing either twelve 10/100/1000BASE-TX ports or eight 10/100/1000BASE-TX ports and four 10GbE ports along with router and IEEE 1588 PTP GMC capability. The 10GbE ports can be either 100/1000/10000BASE-TX or 10GBASE-SR.

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AMPHENOL RF ADDS NEW CONNECTOR OPTIONS TO SMPM PRODUCT LINE

Danbury, CT – Amphenol RF is pleased to announce the expansion of our popular SMPM product line to include several new connector configurations. These connectors utilize the micro-miniature interface and perform at a frequency range of DC to 65 GHz. They are most commonly used in high-frequency coaxial applications with small package design requirements.

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Rugged Electronic and Fiber Optic Components for a Tactical Edge on the Battlefield

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at booth #1117 at Modern Day Marine (MDM) 2017 to explore TE’s passive, electronic and fiber optic components designed specifically to address the evolving expeditionary needs of the United States Marine Corps. Integrated communications is central to improving battlefield connectivity. Modern military operations rely on networking that maximizes situational awareness and effective deployment while maintaining signal integrity and increasing bandwidth.

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ST NEWSBITE: 600V Super-Junction Power Modules Add New Package Options and Features to Simplify Motor Drives

Geneva, September 14, 2017 -- New SLLIMM™-nano intelligent power modules (IPM) from STMicroelectronics introduce extra package options and integrate additional components to accelerate development and simplify assembly of motor drives from very low power up to 300W. The 3A and 5A modules contain state-of-the-art 600V super-junction MOSFETs to maximize energy efficiency in equipment such as compressors, fans, pumps, and other appliances. A choice of packages with inline or zig-zag leads helps optimize space savings and ensure required pin separation. Optional built-in slots allow easy mounting of low-cost heatsinks. In addition, separate open-emitter outputs ease PCB routing for single- or three-shunt current monitoring.

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TE Connectivity DEUTSCH DMC-MD Single Module Connectors Receive EN4165 Certification

HARRISBURG, Pa. – September 14, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, announced that its DEUTSCH DMC-MD single module connectors, accessories and modules received European Standard EN4165 certification, one of the most demanding avionics industry specifications and independent endorsements of the connectors’ quality and performance. Originally invented in the 1980s, DEUTSCH DMC-MD single module connectors from TE have evolved into one of the most widely used connector styles for cabin applications – including in-flight entertainment and lighting systems – in commercial aerospace. DEUTSCH DMC-MD connectors provide a modular, versatile and reliable system. The connectors are available in both multi-cavity and single-module configurations, using the same modules in each arrangement to provide compact, lightweight connectivity.

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Vishay Intertechnology Launches Industry-First High Frequency IHLP® Inductor Series, Boosting DC/DC Efficiency

MALVERN, Pa. — Sept. 14, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first extended-frequency inductor in the low profile, high current IHLP® family. The new IHLP‑1616BZ-0H series features high frequency performance up to 10 MHz with the lowest losses of any inductor on the market for frequencies of 1 MHz and above. By using the IHLP-1616BZ-0H, designers can improve efficiency and potentially reduce the size of DC/DC converter circuitry.

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Stackpole's MELF Resistors are AEC-Q200 Qualified for Harsh Environments

RALEIGH, NC (September 13, 2017) -- Stackpole has recently introduced the MLFA Series of metal film melf resistors. The MLFA Series is fully AEC-Q200 compliant and offered in the 0204 (0.4W) and 0207 (1W) sizes. The MLFA has exceptional stability demonstrated over life, biased humidity, and short time overload testing. In addition, the MLFA offers pulse power handling up to 3500 watts for single short duration pulses, and lightning surge withstanding up to 6KV for resistance values above 100K ohms. This outstanding performance is ideal for applications including industrial / outdoor controls, electric and fuel powered engine controls, power control and monitoring, automotive applications, and telecom infrastructure.

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Extended Modular Connector Line Now Includes Versatile Cable-Clamp Accessory

HARRISBURG, Pa. – September 12, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, has recently released its DEUTSCH DMC-MD single module cable clamp. This new accessory is compatible with the existing DMC-MD single module product line. The product is ideal for use where robust wire and cable retention is required without the need for shielding.

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STMicroelectronics Enters the CAC40 Paris Stock Index

Geneva, September 8, 2017 – The Euronext Scientific Board on Indices announced on September 7, 2017 its decision to include STMicroelectronics (“ST”) in the CAC 40 index, the primary index of the Paris stock exchange, where the Company is listed. This decision will take effect after the closing of the Paris Stock Exchange on September 15, 2017.

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