Rugged unmanned connectivity for air, land and sea at XPONENTIAL 2018

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at AUVSI XPONENTIAL in Denver, Colorado, May 1–3. TE will feature connectivity solutions for unmanned aerial vehicles (UAVs), ground vehicles (UGVs), and underwater vehicle (UUVs) that span commercial and military applications.

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DefExpo 2018: Survivability on the Connected Battlefield

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at its booth (#3.1.4i, Hall 3) at Defexpo in Chennai, India, April 11−14. As one of the world’s largest suppliers of passive electronic components, TE possesses a diverse array of rugged connector solutions designed to support mission readiness in military and defense applications.

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STMicroelectronics Making Everything Smarter at IoT Asia 2018

Singapore, March 20, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will be demonstrating its latest innovative solutions for the Internet of Things (IoT) and Smart Driving at IoT Asia, Singapore Expo, March 21-22, 2018. At the event, ST will highlight its rich portfolio of solutions for making Driving, Cities, and Things Smarter.

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Connecting marine defense systems in harsh environments

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at the Underwater Defense & Security show in Portsmouth, England, March 20−22. TE will showcase its wide range of military connector and wire and cable solutions that meet the unique needs of marine defense forces.

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Durable Ethernet connectivity in subsea environments

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at its SEACON booth (#444) at Underwater Intervention in New Orleans, Louisiana, Feb. 6-8. TE will showcase its Ethernet connectivity solutions for harsh subsea environments, including a range of high integrity connectors for Cat5 and Cat5e applications.

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TE Connectivity debuts high density power card edge solution for data centers

HARRISBURG, Pa. – January 25, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced its high density (HD) card edge power connector, which delivers among the highest current density in the market to support high power supply applications. TE’s new HD card edge connector delivers higher current than previous power card edge connectors at 25A/contact with low resistance, and supports 1500-2000W power supplies for data center equipment. With a maximum operating temperature of 130 degrees Celsius, the connector provides reliable performance in harsh environments. In addition, the signal pitch is 1.27mm (compatible with common industry PCB footprint designs), and the elasticity of the power/signal pins provides low mating force.

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TE Connectivity named a 'Top 100 Global Innovator' for seventh consecutive year

TE Connectivity named a 'Top 100 Global Innovator' for seventh consecutive year HARRISBURG, Pa. – Jan. 25, 2018 – TE Connectivity (TE), a world leader in connectivity and sensor solutions, has been named a 2017 Top 100 Global Innovator by Clarivate Analytics. The annual report highlights the most successful organizations in the world that are active in innovation through research and development, protection of their IP and the achievement of commercial success.

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TE Connectivity showcases its leadership in computing and industry standards at DesignCon 2018

HARRISBURG, Pa. – January 24, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working Group (EDSFF) have adopted TE’s Sliver internal cabled and card edge interconnects as the standardized connector solutions in their server, storage and networking designs. Sliver interconnects provide one of the most flexible, high-performance solutions in the market for making internal input/output (I/O) connections on the board.

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