Durable Ethernet connectivity in subsea environments

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at its SEACON booth (#444) at Underwater Intervention in New Orleans, Louisiana, Feb. 6-8. TE will showcase its Ethernet connectivity solutions for harsh subsea environments, including a range of high integrity connectors for Cat5 and Cat5e applications.

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TE Connectivity debuts high density power card edge solution for data centers

HARRISBURG, Pa. – January 25, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced its high density (HD) card edge power connector, which delivers among the highest current density in the market to support high power supply applications. TE’s new HD card edge connector delivers higher current than previous power card edge connectors at 25A/contact with low resistance, and supports 1500-2000W power supplies for data center equipment. With a maximum operating temperature of 130 degrees Celsius, the connector provides reliable performance in harsh environments. In addition, the signal pitch is 1.27mm (compatible with common industry PCB footprint designs), and the elasticity of the power/signal pins provides low mating force.

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TE Connectivity named a 'Top 100 Global Innovator' for seventh consecutive year

TE Connectivity named a 'Top 100 Global Innovator' for seventh consecutive year HARRISBURG, Pa. – Jan. 25, 2018 – TE Connectivity (TE), a world leader in connectivity and sensor solutions, has been named a 2017 Top 100 Global Innovator by Clarivate Analytics. The annual report highlights the most successful organizations in the world that are active in innovation through research and development, protection of their IP and the achievement of commercial success.

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TE Connectivity showcases its leadership in computing and industry standards at DesignCon 2018

HARRISBURG, Pa. – January 24, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working Group (EDSFF) have adopted TE’s Sliver internal cabled and card edge interconnects as the standardized connector solutions in their server, storage and networking designs. Sliver interconnects provide one of the most flexible, high-performance solutions in the market for making internal input/output (I/O) connections on the board.

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High-speed fiber optic electronic packaging gets ruggedized

HARRISBURG, Pa. – December 12, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, has released its newly developed optical flex circuit cable assemblies. These compact, robust fiber optic circuits offer a multifiber management solution for high-speed electronic packaging. Fully customizable for both card-to-card and backplane applications, TE’s new optical flex circuits are ruggedized for the harsh environments of aerospace, commercial and military aircraft, and defense systems.

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TE Cable Assemblies Minimize Cost, Speed Time to Market for Virtual Reality Startups

HARRISBURG, Pa. – November 16, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced a line of virtual reality (VR) cable assemblies that speed time to market and offer superior performance compared to other solutions in the market. TE’s cable assemblies for VR applications enable VR solution providers to get to market faster with a proven platform design that can be easily and quickly modified to address their needs. TE can provide the entire cable assembly and high-speed receptacle, or just the plug modules if the cable is sourced from another supplier. The low-profile receptacle saves valuable printed control board (PCB) space in the headset, while the use of equalizers within the connectors on the cable assembly extends the reach of thin cable, keeping cable weight low.

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TE Connectivity Keeps Data Moving on the Race Track

November 15-17, 2017 TE Connectivity Booth #3052, Hall 10.1 Koelnmesse — Cologne, Germany. Both on the road and on the race track, tracking speed is no longer enough. Data is key in motorsports, and cars generate a lot of data. Engineers use this critical information to determine how to service a vehicle. In addition, data about oil temperature, pressure and more can help determine the health of a vehicle. TE Connectivity's connectors and sensors help translate this information to track-side engineers, instantly.

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Spacecraft tech gets boost in reliability and connectivity

Members of the media are invited to join TE Connectivity (TE), a world leader in connectivity and sensors, at Space Tech Expo Europe to experience TE’s breadth of solutions optimized for the rigors of space launch and spacecraft applications. TE continually innovates its products to bring smaller, lighter connectivity solutions that are suited for the extreme conditions of space launch vehicles, spacecraft chassis, satellites, manned missions and deep space exploration.

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TE Connectivity to feature rugged, cutting-edge connectivity technology for C4ISR applications at MILCOM 2017

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at MILCOM 2017 to explore TE’s advanced portfolio of interconnected products for C4ISR (Command, Control, Communications, Computing, Intelligence, Surveillance and Reconnaissance) applications and other electronic warfare systems. TE is focused on providing smaller, lighter, more rugged connectivity solutions for electronic warfare applications. Minimizing size, weight and power consumption (SWaP) in these and other applications is vital to increasing bandwidth and enabling open architecture systems.

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STMicroelectronics Combines Unique Development Ecosystem with Alibaba AliOS for First Chinese Cloud-to-Node IoT Platform

Hangzhou, China, October 13, 2017 – STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today its cooperation with Alibaba Cloud, the cloud computing arm and business unit of Alibaba Group (NYSE: BABA), to provide a complete cloud-to-node IoT solution to the market. The cooperation will allow any designer to easily create IoT nodes and gateways using ST’s key semiconductor building blocks for the IoT, run Alibaba’s IoT operating system AliOS on the node, and seamlessly connect with the Alibaba Cloud for faster time-to-market of large-volume IoT applications.

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