TE Connectivity debuts high density power card edge solution for data centers

HARRISBURG, Pa. – January 25, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced its high density (HD) card edge power connector, which delivers among the highest current density in the market to support high power supply applications. TE’s new HD card edge connector delivers higher current than previous power card edge connectors at 25A/contact with low resistance, and supports 1500-2000W power supplies for data center equipment. With a maximum operating temperature of 130 degrees Celsius, the connector provides reliable performance in harsh environments. In addition, the signal pitch is 1.27mm (compatible with common industry PCB footprint designs), and the elasticity of the power/signal pins provides low mating force.

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STMicroelectronics Launches Digital Multiphase Controllers for Energy-Efficient Power Delivery in Servers and Data Centers

STMicroelectronics’ new PM6773 and PM6776 step-down controllers meet demands for more accurate and energy-efficient power delivery in servers and data centers using the latest low-voltage, high-current microprocessors, ASICs, and field-programmable devices. In particular, the new ICs are designed to power Intel Skylake CPUs and DDR4 memories, extending ST’s family of digital step-down controllers for Intel VR13 platforms.

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