TE Connectivity enables future of 400GbE at DesignCon 2018

HARRISBURG, Pa. – January 31, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices. TE will demonstrate the new products in booth 817 at the DesignCon 2018 expo on January 31-February 1 in Santa Clara, California.

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TE Connectivity showcases its leadership in computing and industry standards at DesignCon 2018

HARRISBURG, Pa. – January 24, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working Group (EDSFF) have adopted TE’s Sliver internal cabled and card edge interconnects as the standardized connector solutions in their server, storage and networking designs. Sliver interconnects provide one of the most flexible, high-performance solutions in the market for making internal input/output (I/O) connections on the board.

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A Special Discount to Join us at DesignCon 2018

This is your exclusive invitation to attend the largest meeting of chip, board, and systems design engineers with a complimentary Expo Pass or a 20% discount on Conference Packages! Now in its 23rd year, DesignCon offers high-caliber content, rich technical education, and in-depth training – all created by engineers for engineers.

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