TE Connectivity Debuts ChipConnect Cable Assemblies

HARRISBURG, Pa. – August 3, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, announced today its new ChipConnect internal faceplate-to-processor (IFP) cable assemblies. Designed for Intel Omni-Path Architecture (OPA), TE’s ChipConnect assemblies mate directly with LGA 3647 sockets at the processor and Intel Omni-Path internal faceplate transition (IFT) ports at the faceplate for 25 Gbps speeds. These new cable assemblies reduce system design time and costs by eliminating the need to use costlier, lower-loss printed circuit board (PCB) materials and associated re-timers to route signal. System design is made easier by reducing the complexity of PCB laminates and routing.

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