Vishay Asia Honored by Siemens With 2017 SEWC Best Cooperation Supplier Award

MALVERN, Pa. — April 12, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that Vishay Intertechnology Asia Pte. Ltd. has been honored by Siemens, one of the world's largest producers of energy-efficient, resource-saving technologies, with a 2017 Siemens Electronic Works Chengdu (SEWC) Best Cooperation Supplier Award.

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Vishay Intertechnology to Highlight Latest Grid and Ribwound Resistors at 2018 IEEE PES T&D Conference and Expo

MALVERN, Pa. — April 10, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company will be exhibiting its latest grid and ribwound resistors for oil and gas, industrial, traction, and renewable energy power systems at the 2018 IEEE PES T&D Conference and Expo, the largest and most comprehensive show in the transmission and distribution industry. Exhibiting in booth 2236 during the show, April 16-19 at the Colorado Convention Center in Denver, Vishay will highlight the Vishay Milwaukee GRE1, GRE2, and GRE3 series of high power, high current grid resistors, RBEF / RBSF series of ribwound resistors, and NGR series of neutral ground resistors.

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AVX Releases the First Industrial Poke-Home Connector Available Without a Wire Stop

FOUNTAIN INN, S.C. (April 9, 2018) - AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, has released the first industrial poke-home connector available without a wire stop. The new 2.5mm poke-home contact - the latest addition to its 70-9296 Series STRIPT™ insulator-less, single-position, horizontal, poke-home contacts - combines a low profile with an industry-leading range of compatible wire gauges: 20-26AWG solid and stranded wire, and is the first in the series and on the market to offer variants both with and without a wire stop.

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Bourns Satisfies Movement to Adopt Environmentally Safe Green Technologies with New Ultra-Low Lead Content Thick Film Chip Resistors

RIVERSIDE, Calif., March 20, 2018 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today introduced a new series of ultra-low lead content† thick film chip resistors. The Bourns® Model CR-PF Series is RoHS compliant* without exemptions, helping customers satisfy the movement to adopt more environmentally safe green technologies. Bourns designed its latest thick film resistors for general purpose consumer, industrial and telecommunication market applications.

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Bourns Expands Leading Line of ESD Protection Products with New ChipGuard® Device for Mobile Electronics

RIVERSIDE, Calif., March 13, 2018 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the expansion of its leading line of ESD protection products. The company's new Model CG0201MLC ChipGuard® device delivers ultra-low capacitance (0.2 pF) in a miniature 0201 package. These features meet ongoing performance and small footprint requirements in space-constrained applications such as wearables, handheld devices, headphones, tablets and mobile phones.

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Vishay Intertechnology Announces Support for Commercial MLCCs Being Discontinued by Certain Suppliers

MALVERN, Pa. — March 8, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it is offering a number of essential multilayer chip capacitors (MLCCs) for which end-of-life (EOL) product change notifications (PCNs) have recently been issued by certain component manufacturers. The company is also offering supportive delivery times for a number of MLCC products currently experiencing shortages on the world market.

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Bourns Features World-class Electronic Components for Industrial, Communication, Consumer and Automotive Applications at electronica China 2018

RIVERSIDE, Calif., March 7, 2018 - Bourns, Inc., a leading manufacturer and supplier of electronic components, is known for delivering the highest quality circuit protection, circuit conditioning and motion control devices that engineers need to safeguard, control and manage their latest system and product designs. At the upcoming electronica China 2018 show, Bourns will showcase its full line of electronic component solutions designed to meet a broad range of industrial, communication, consumer and automotive application requirements.

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New Vishay Intertechnology Miniaturized Gate Drive Transformers in Planar Package Save Space Over Traditional Winding Technology

MALVERN, Pa. — March 7, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of miniaturized gate drive transformers designed to save space in high power military and aerospace, industrial, and medical applications. Featuring a compact 20.57 mm by 18.42 mm planar package with a low 11.43 mm profile, Vishay Custom Magnetics' MGDT series devices offer low losses and 8 mm minimum creepage and clearance.

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Simplify Industrial-Grade Linux Designs with SAMA5D2 MPU-Based System On Module (SOM)

CHANDLER, Ariz., February 20, 2018 — There is a great deal of design effort and complexity associated with creating an industrial-grade microprocessor (MPU)-based system running a Linux® operating system. Even developers with expertise in the area spend a lot of time on PCB layout to guarantee signal integrity for the high-speed interfaces to DDR memory and Ethernet Physical Layer (PHY) while complying with Electromagnetic Compatibility (EMC) standards. To remove the traditional design complexity in this space, Microchip Technology Inc. (NASDAQ: MCHP) has unveiled a new System on Module (SOM) featuring the SAMA5D2 MPU. The ATSAMA5D27-SOM1, which contains the recently released ATSAMA5D27C-D1G-CU System in Package (SiP), greatly simplifies design by integrating the power management, non-volatile boot memory, Ethernet PHY and high-speed DDR2 memory onto a small, single-sided Printed Circuit Board (PCB).

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STMicroelectronics Signs License and Cooperation Agreement on LDMOS Technology from Innogration

Geneva, February 14, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has signed an agreement on LDMOS LDMOS - Laterally Diffused Metal Oxide Semiconductor RF power technology from Innogration Technologies, a fabless semiconductor company headquartered in Suzhou, China, specializing in the design and manufacturing of RF power semiconductor devices, modules, and sub-system assemblies.

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