Complete Full-Bridge System-in-Package from STMicroelectronics Includes MOSFETs, Gate Drivers, and Protection to Save Space, Simplify Design, and Streamline Assembly

Geneva, December 4, 2017 -- STMicroelectronics’ PWD13F60 System-in-Package (SiP) contains a complete 600V/8A single-phase MOSFET full bridge in a 13mm x 11mm outline, saving bill-of-materials costs and board space in industrial motor drives, lamp ballasts, power supplies, converters, and inverters. With a footprint 60% smaller than a comparable circuit built from discrete components, the PWD13F60 can also boost end-application power density. By integrating four power MOSFETs, it presents a uniquely efficient alternative to other modules on the market that are typically dual-FET half-bridge or six-FET three-phase devices. Unlike either of these choices, only one PWD13F60 is needed to implement a single-phase full bridge, leaving no internal MOSFETs unused. There is also flexibility to configure the module as one full bridge or two half bridges.

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AVX Releases New FHC1 & FHC2 Series Power Film Capacitors for EV/HEV Applications

AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has released the new FHC1 and FHC2 Series power film capacitors, which were especially designed for electric and hybrid electric vehicle (EV/HEV) applications. Exhibiting high ripple current capabilities, extremely high dielectric strength in operating conditions up to 115°C, low inductance, low ESR, and a low thermal footprint, the new FHC Series capacitors deliver high-reliability performance that compliments and protects high-power-density inverter products.

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