Qeexo and STMicroelectronics Accelerate Adoption of Qeexo’s FingerSense by OEMs

Mountain View, CA, and Geneva, Switzerland – January 4, 2018 – Qeexo, a developer of machine learning and AI solutions for sensor data, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across a spectrum of electronics applications, today announced a collaboration to further accelerate integration of Qeexo’s FingerSense technology by OEMs.

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STMicroelectronics Cooperating with MediaTek to Integrate Industry-Leading NFC Technology into Mobile-Platform Designs

Geneva, September 5, 2017 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced the integration of its contactless NFC technology with MediaTek’s mobile platforms. This creates a complete solution for handset developers to design next-generation smartphones capable of supporting tightly integrated NFC mobile services.

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Industry’s First Automotive-Grade LIN System-in-Package Solution Including a Microcontroller with Touch Hardware Support

The industry’s first automotive-grade Local Interconnect Network (LIN) System-in-Package (SiP) solution including a microcontroller with integrated touch hardware support is now available from Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. The SAMHA1GxxA microcontroller family contains capacitive touch hardware support, an event system and complex PWM capability. The series is ideal for touch button, touchpad, slider, wheel or proximity sensing applications, including optical and haptic feedback.

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STMicroelectronics Collaborates with Qualcomm on Sensors for Smart Mobile Devices

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced that Qualcomm Technologies Inc., a subsidiary of Qualcomm Incorporated, intends to add software support for ST’s inertial sensor solutions including its award-winning iNEMO™ inertial module. The Companies expect that the support will enable the rapid introduction of Android™ smartphones based on Qualcomm® Snapdragon™ processors with minimized power consumption and high-performing sensor capabilities through the use of hardware features integrated into the sensor.

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Molex Launches Impel™ Plus Backplane Connectors at DesignCon

Molex, LLC will debut its new Impel™ Plus Backplane Connectors in Molex booth 817 at the DesignCon 2016 Expo, to be held January 20-21 at the Santa Clara Conference Center in Santa Clara, CA. An extension of the Impel™ Backplane Connector family, Impel Plus connectors include a grounding tail aligners and smaller signal compliant pins. An innovative signal beam design improves insertion loss compared to in-line beams and pushes interface resonance frequency past 30 GHz.

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