TE Connectivity Releases Standard Board Level Shielding Portfolio

HARRISBURG, Pa. – June 7, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, announced today its new standard portfolio of board level shielding (BLS), providing customers with shorter time to market, weight savings, and improved thermal conductivity. In addition to TE’s custom-designed BLS solutions, these BLS products are ideal for 2-in-1 notebooks, game consoles, routers, point of sale (POS) equipment, wireless meters, wearable devices, Internet of Things (IoT) devices, servers, and other applications where weight, thermal performance, and electromagnetic shielding are crucial.

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TE Connectivity announces Sliver internal cabled interconnects

TE Connectivity (TE), a world leader in connectivity and sensors, today announced the launch of its new Sliver internal cabled interconnects, which provide one of the most flexible solutions in the market for making internal input/output (I/O) connections on the board. This new technology simplifies design and helps lower overall costs by eliminating the need for re-timers and costlier, lower-loss printed circuit board (PCB) materials, while reaching speeds up to 25 gigabits per second (Gbps) with the use of TE high speed cable.

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