Durable Ethernet connectivity in subsea environments

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at its SEACON booth (#444) at Underwater Intervention in New Orleans, Louisiana, Feb. 6-8. TE will showcase its Ethernet connectivity solutions for harsh subsea environments, including a range of high integrity connectors for Cat5 and Cat5e applications.

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TE Connectivity and Credo pave the way for 112G single lane connectivity

HARRISBURG, Pa. – January 31, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, and Credo, a leading provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies. The companies will hold demonstrations of 112Gbps over a chip to module (IO) channel and over a backplane channel at DesignCon 2018. The demonstrations will be unveiled in booth #817 at DesignCon, which takes place in the Santa Clara, CA convention center from January 31 through February 1. As industry groups such as OIF and IEEE meet to discuss feasibility of these types of links at these next-generation data rates, TE and Credo will be demonstrating performance on actual hardware.

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AVX Extends its Portfolio of High-Performance, Low-Pass Integrated Thin Film Filters With Six New 8W, 1206 Chip-Size Solutions Spanning 700MHz to 3.8GHz

FOUNTAIN INN, S.C. (January 30, 2018) - AVX Corporation, a leading manufacturer and supplier of passive components, interconnects, sensors, and control solutions, has extended its portfolio of high-performance, low-pass integrated thin film (ITF) filters with the release of six new 8W LP Series filters in miniature 1206 chip sizes with low maximum height profiles of 0.97mm. Based on proven thin film multilayer technology, the new SMD filters deliver excellent high-frequency performance with low insertion loss and extremely sharp attenuation in wireless applications with frequencies spanning 700MHz to 3.8GHz, including: military and mobile communications systems, wireless large area networks (LANs), global positioning systems, vehicle location systems, and satellite television receivers. The new 8W LP Series ITF SMD filters also feature a rugged construction designed for reliable automatic assembly, allow installers to visually inspect the solder fillet after mounting, and provide a higher-power complement to AVX's existing 3W LGA-terminated 1206 LP Series offering.

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TE Connectivity debuts high density power card edge solution for data centers

HARRISBURG, Pa. – January 25, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced its high density (HD) card edge power connector, which delivers among the highest current density in the market to support high power supply applications. TE’s new HD card edge connector delivers higher current than previous power card edge connectors at 25A/contact with low resistance, and supports 1500-2000W power supplies for data center equipment. With a maximum operating temperature of 130 degrees Celsius, the connector provides reliable performance in harsh environments. In addition, the signal pitch is 1.27mm (compatible with common industry PCB footprint designs), and the elasticity of the power/signal pins provides low mating force.

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AVX Expands its 0805 High-Performance, Low-Pass LP Series Integrated Thin Film Filters by Elevenfold

FOUNTAIN INN, S.C. (January 24, 2018) - AVX Corporation, a leading manufacturer and supplier of passive components, interconnects, sensors, and control solutions, has added 11 new frequencies to its 0805 high-performance, low-pass LP Series integrated thin film (ITF) SMD filters. Now available in 700, 750, 780, 942, 1000, 1250, 1800, 1900, 2400, 2900, 3500, and 4000MHz variants, the 0805 filters are compact and low-profile - measuring just 2.03 x 1.55 x 0.80mm ±0.10mm (l x w x h) - and exhibit low insertion loss and extremely sharp roll-off ideally suited for a broad range of high-frequency wireless applications including: mobile communications systems, microcell and picocell base stations, satellite TV receivers, global positioning and vehicle location systems, and wireless LANs.

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TE Connectivity showcases its leadership in computing and industry standards at DesignCon 2018

HARRISBURG, Pa. – January 24, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working Group (EDSFF) have adopted TE’s Sliver internal cabled and card edge interconnects as the standardized connector solutions in their server, storage and networking designs. Sliver interconnects provide one of the most flexible, high-performance solutions in the market for making internal input/output (I/O) connections on the board.

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AVX Releases New Accu-L® Series Thin Film Chip Inductors for Automotive Signal & Power Applications

FOUNTAIN INN, S.C. (January 22, 2018) -AVX Corporation, a leading manufacturer and supplier of passive components, interconnects, sensors, and control solutions, has released a new series of thin film multilayer chip inductors especially designed to meet demanding performance specifications in automotive signal and power applications. Qualified to AEC-Q200, the new automotive grade Accu-L® Series inductors exhibit ultra-tight inductance tolerances down to ±0.05nH, in addition to: RF power capabilities, high Q, high self-resonant frequency (SRF), low DC resistance (Rdc), and outstanding high-frequency performance from 450MHz to 2,400MHz. Available in small, ruggedly constructed, low profile 0402 and 0805 chip sizes, the series also delivers exceptional intra-lot and lot-to-lot physical and electrical consistency that makes it ideal for use in automotive signal and power applications that require apex accuracy, including: matching networks and filters in vehicle-to-vehicle communications, infotainment, vehicle location, keyless entry, global positioning, and radar systems.

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Autotalks and STMicroelectronics Show World's First Mass-Market-Ready 2nd-Generation V2X Solution during CES 2018

Consumer Electronics Show, Las Vegas, Nevada – January 4, 2018 – Autotalks, the global leader in V2X (Vehicle to Everything) communication chipsets, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, are working together to save lives and improve mobility on the roads through the use of DSRC (Dedicated Short Range Communication) -based Vehicle-to-Everything (V2X) communications technology. The partners will highlight both Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) use cases during CES® 2018 in Las Vegas.

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New Vertical, Poke-Home, Wire-To-Board Connectors for Discrete 18-22AWG Wire

FOUNTAIN INN, S.C. (December 15, 2017) - AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has extended its range of vertical wire-to-board (WTB) connector solutions with the release of the new 00-9296 Series single-position, vertical, top-entry, poke-home connectors for discrete 18-22AWG solid or stranded wire. The new 00-9296 Series connectors deliver simple, robust, repeatable, and cost-effective wire terminations designed to replace both labor-intensive and inconsistent hand-soldered connections, as well as costly, two-piece connector solutions in perpendicular, low-pin-count industrial, commercial, smart grid, and SSL applications with limited PCB space and conditions that make it difficult to achieve repetitive and reliable processes and maintain solder integrity.

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High-speed fiber optic electronic packaging gets ruggedized

HARRISBURG, Pa. – December 12, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, has released its newly developed optical flex circuit cable assemblies. These compact, robust fiber optic circuits offer a multifiber management solution for high-speed electronic packaging. Fully customizable for both card-to-card and backplane applications, TE’s new optical flex circuits are ruggedized for the harsh environments of aerospace, commercial and military aircraft, and defense systems.

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