TE Connectivity showcases its leadership in computing and industry standards at DesignCon 2018

HARRISBURG, Pa. – January 24, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working Group (EDSFF) have adopted TE’s Sliver internal cabled and card edge interconnects as the standardized connector solutions in their server, storage and networking designs. Sliver interconnects provide one of the most flexible, high-performance solutions in the market for making internal input/output (I/O) connections on the board.

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Improve Digital Support of Battery Charging and DC-DC Conversion Applications with New Digitally Enhanced Power Analog Controllers from Microchip

A new Digitally Enhanced Power Analog (DEPA) controller designed to regulate current, regulate voltage and monitor temperature is now available from Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. The device improves digital support for battery charging and is ideal for DC-DC conversion in server, consumer, industrial and automotive applications.

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