TE Connectivity Releases Standard Board Level Shielding Portfolio

HARRISBURG, Pa. – June 7, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, announced today its new standard portfolio of board level shielding (BLS), providing customers with shorter time to market, weight savings, and improved thermal conductivity. In addition to TE’s custom-designed BLS solutions, these BLS products are ideal for 2-in-1 notebooks, game consoles, routers, point of sale (POS) equipment, wireless meters, wearable devices, Internet of Things (IoT) devices, servers, and other applications where weight, thermal performance, and electromagnetic shielding are crucial.

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New Vishay Intertechnology IHLP® Inductor Offers High Temperature Performance for Commercial and Industrial Applications in Extreme Environments

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new IHLP® low profile, high current inductor in the 1616 case size that combines a high operating temperature to +155 °C with a low profile of 2 mm for commercial and industrial applications in extreme environments. With a frequency range up to 2 MHz, the Vishay Dale IHLP-1616BZ-51 is optimized for energy storage in DC/DC converters and high current filtering up to the self-resonant frequency (SRF) of the inductor (see table below). Applications include notebooks, desktop PCs, and servers; low profile, high current power supplies, PMICs, and point of load (POL) converters; industrial and telecommunications power systems; and DC/DC converters for distributed power systems and FPGAs.

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STMicroelectronics Launches Digital Multiphase Controllers for Energy-Efficient Power Delivery in Servers and Data Centers

STMicroelectronics’ new PM6773 and PM6776 step-down controllers meet demands for more accurate and energy-efficient power delivery in servers and data centers using the latest low-voltage, high-current microprocessors, ASICs, and field-programmable devices. In particular, the new ICs are designed to power Intel Skylake CPUs and DDR4 memories, extending ST’s family of digital step-down controllers for Intel VR13 platforms.

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TE Connectivity announces Sliver internal cabled interconnects

TE Connectivity (TE), a world leader in connectivity and sensors, today announced the launch of its new Sliver internal cabled interconnects, which provide one of the most flexible solutions in the market for making internal input/output (I/O) connections on the board. This new technology simplifies design and helps lower overall costs by eliminating the need for re-timers and costlier, lower-loss printed circuit board (PCB) materials, while reaching speeds up to 25 gigabits per second (Gbps) with the use of TE high speed cable.

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Vishay Intertechnology Releases Commercial Version of the Popular Automotive Grade IHLE Integrated E-Shield Inductor

Vishay Intertechnology, Inc. (NYSE: VSH) today announced a commercial version of its popular Automotive Grade IHLE series of low profile, high current inductors featuring integrated e-shields for EMI reduction. Available in the 2525, 3232, and 4040 case sizes, the Vishay Dale IHLE-2525CD-51, IHLE-3232DD-51, and IHLE-4040DD-51 contain the electric field associated with EMI in a tin-plated copper integrated shield, providing up to -20 dB of electric field reduction at 1 cm (above the center of the inductor) when the integrated shield is connected to ground. By eliminating the need for expensive board-level Faraday shielding to lower EMI, the devices reduce costs and save board space.

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