STMicroelectronics and Objenious Collaborate to Speed Connection of IoT Nodes to LoRa® Networks

Geneva, Switzerland, and Sevres, France, October 3, 2017 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and member of the board of the LoRa Alliance™, and Objenious, a founding member of the LoRa Alliance and the first carrier in France to provide a nationwide LoRa® network, are working together to accelerate the connection of Internet-of-Things (IoT) nodes to LoRa networks. ST’s development kits certified on the Objenious network are available now, greatly reducing R&D effort and time to market in the creation of new LoRa devices.

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STMicroelectronics Selected Technical Partner of E-Distribuzione for Its New Smart-Meter Platform

Geneva, September 25, 2017 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is supporting E-Distribuzione, the Enel Group company holding the concession for electricity-distribution services, in the deployment of “Open Meter,” the second-generation smart-meter platform designed and developed by E-Distribuzione.

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ST NEWSBITE: 600V Super-Junction Power Modules Add New Package Options and Features to Simplify Motor Drives

Geneva, September 14, 2017 -- New SLLIMM™-nano intelligent power modules (IPM) from STMicroelectronics introduce extra package options and integrate additional components to accelerate development and simplify assembly of motor drives from very low power up to 300W. The 3A and 5A modules contain state-of-the-art 600V super-junction MOSFETs to maximize energy efficiency in equipment such as compressors, fans, pumps, and other appliances. A choice of packages with inline or zig-zag leads helps optimize space savings and ensure required pin separation. Optional built-in slots allow easy mounting of low-cost heatsinks. In addition, separate open-emitter outputs ease PCB routing for single- or three-shunt current monitoring.

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STMicroelectronics Enters the CAC40 Paris Stock Index

Geneva, September 8, 2017 – The Euronext Scientific Board on Indices announced on September 7, 2017 its decision to include STMicroelectronics (“ST”) in the CAC 40 index, the primary index of the Paris stock exchange, where the Company is listed. This decision will take effect after the closing of the Paris Stock Exchange on September 15, 2017.

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New 8-bit Microcontroller from STMicroelectronics Delivers Uniquely Flexible Feature Set in Space/Cost-Saving 8-Pin Package

Geneva, September 7, 2017 – STMicroelectronics is extending choice and freedom for budget-conscious designers by introducing its new 8-bit STM8S001 microcontroller (MCU) in the economical SO-8 package. Unlike most rivals, the STM8S001 has I2C, UART, and SPI interfaces, giving unusually versatile connectivity options. With a generous 8KB Flash memory, 1KB RAM, 128-byte EEPROM, and 3-channel 10-bit ADC also on-chip, it delivers key features of ST’s most popular STM8S003 MCU in a space-saving, low-pin-count device.

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Sequans and STMicroelectronics Introduce New LTE Tracker Platform to Connect and Locate Objects Everywhere

Paris, France; Geneva, Switzerland – September 7, 2017 – Sequans Communications S.A. (NYSE: SQNS), a leading LTE chipmaker, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today introduced CLOE, a new LTE-connected tracker platform based on the integration of Sequans and ST technologies. An acronym of Connecting and Locating Objects Everywhere, CLOE combines the Internet-of-Things (IoT) technologies of two industry leaders into one comprehensive platform that simplifies the development of LTE-based IoT tracker devices for the full range of vertical markets, including logistics, consumer electronics, and automotive.

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STMicroelectronics Cooperating with MediaTek to Integrate Industry-Leading NFC Technology into Mobile-Platform Designs

Geneva, September 5, 2017 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced the integration of its contactless NFC technology with MediaTek’s mobile platforms. This creates a complete solution for handset developers to design next-generation smartphones capable of supporting tightly integrated NFC mobile services.

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