TE Connectivity showcases its leadership in computing and industry standards at DesignCon 2018

HARRISBURG, Pa. – January 24, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working Group (EDSFF) have adopted TE’s Sliver internal cabled and card edge interconnects as the standardized connector solutions in their server, storage and networking designs. Sliver interconnects provide one of the most flexible, high-performance solutions in the market for making internal input/output (I/O) connections on the board.

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TE Connectivity’s CDFP Connectors, Cages and Cable Assemblies Now Deliver Faster Speeds with Greater Flexibility

HARRISBURG, Pa. – December 13, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that its CDFP connectors and cages now bring up to 28 gigabit per second (Gbps) data rates and new levels of flexibility to designers of high-speed networking systems and subsystems. In addition, a new range of customizable CDFP cable assemblies supports PCIe Gen 3 (8 Gbps) system requirements.

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microQSFP Extends Use Cases with Industry Adoption in 2x50G and 1x50G Applications

HARRISBURG, Pa. – September 25, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that its microQSFP pluggable connectors, cages and cable assemblies are gaining rapid traction in the industry as indicated by cloud server application design wins and significant ongoing data center switches, and wireless networking equipment design efforts.

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Increase Software Power Measurement Accuracy to 99 Percent in Windows 10 Devices with New Power Monitoring IC from Microchip

CHANDLER, Ariz., Sep. 19, 2017 — The PAC1934, a precision power and energy monitoring chip, is now available from Microchip Technology Inc. (NASDAQ: MCHP). The chip works in conjunction with a Microchip software driver that is fully compatible with the Energy Estimation Engine (E3) built into the Windows 10 operating system to provide 99 percent accuracy on all Windows 10 devices that have batteries. Combining Microchip’s PAC1934 and Windows 10 driver with Microsoft’s E3 service can improve the measurement of battery usage from different software applications by up to 29 percent.

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TE Connectivity announces Sliver internal cabled interconnects

TE Connectivity (TE), a world leader in connectivity and sensors, today announced the launch of its new Sliver internal cabled interconnects, which provide one of the most flexible solutions in the market for making internal input/output (I/O) connections on the board. This new technology simplifies design and helps lower overall costs by eliminating the need for re-timers and costlier, lower-loss printed circuit board (PCB) materials, while reaching speeds up to 25 gigabits per second (Gbps) with the use of TE high speed cable.

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