Reliable waterproof solutions for sewer and wastewater connectivity

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at its SEACON booth (#1110) at Water & Wastewater Equipment, Treatment & Transport (WWETT) in Indianapolis, Indiana, February 21-24. TE will display its electrical connector solutions designed specifically for the sewer and wastewater industries, including a range of rubber-molded connectors and rugged cables.

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New in-line dry-mate connector offers increased environmental protection for marine fiber optics

HARRISBURG, Pa. – Feb. 7 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, revealed today its new DEUTSCH high density optical in-line dry-mate connector. TE developed this multichannel fiber optic connector from reliable high pressure/high temperature (HP/HT) fiber optic technology that is backed by more than 30 years of performance in the field. It was designed to withstand harsh offshore environments and is ideal for applications that need maximum space and weight savings.

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Designing the connected aircraft for smarter, faster connectivity

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at the 2018 Singapore Air Show, (booth #B24), February 6-9, to see how TE is creating solutions that enable engineers to design and build the next generation of connected aircraft. Increased connectivity is at the heart of modern commercial and military aircraft design. Commercial passengers demand seamless access to the internet and streaming media, while pilots and ground crews require more information at faster speeds to manage increasingly complex aircraft systems. To meet these demands, TE Connectivity (TE) is working side-by-side with design engineers to develop technologies that provide reliable performance in harsh environments, making modern air travel faster, more efficient and enjoyable.

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Durable Ethernet connectivity in subsea environments

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, at its SEACON booth (#444) at Underwater Intervention in New Orleans, Louisiana, Feb. 6-8. TE will showcase its Ethernet connectivity solutions for harsh subsea environments, including a range of high integrity connectors for Cat5 and Cat5e applications.

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TE Connectivity and Credo pave the way for 112G single lane connectivity

HARRISBURG, Pa. – January 31, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, and Credo, a leading provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies. The companies will hold demonstrations of 112Gbps over a chip to module (IO) channel and over a backplane channel at DesignCon 2018. The demonstrations will be unveiled in booth #817 at DesignCon, which takes place in the Santa Clara, CA convention center from January 31 through February 1. As industry groups such as OIF and IEEE meet to discuss feasibility of these types of links at these next-generation data rates, TE and Credo will be demonstrating performance on actual hardware.

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TE Connectivity enables future of 400GbE at DesignCon 2018

HARRISBURG, Pa. – January 31, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices. TE will demonstrate the new products in booth 817 at the DesignCon 2018 expo on January 31-February 1 in Santa Clara, California.

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TE Connectivity debuts high density power card edge solution for data centers

HARRISBURG, Pa. – January 25, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced its high density (HD) card edge power connector, which delivers among the highest current density in the market to support high power supply applications. TE’s new HD card edge connector delivers higher current than previous power card edge connectors at 25A/contact with low resistance, and supports 1500-2000W power supplies for data center equipment. With a maximum operating temperature of 130 degrees Celsius, the connector provides reliable performance in harsh environments. In addition, the signal pitch is 1.27mm (compatible with common industry PCB footprint designs), and the elasticity of the power/signal pins provides low mating force.

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TE Connectivity named a 'Top 100 Global Innovator' for seventh consecutive year

TE Connectivity named a 'Top 100 Global Innovator' for seventh consecutive year HARRISBURG, Pa. – Jan. 25, 2018 – TE Connectivity (TE), a world leader in connectivity and sensor solutions, has been named a 2017 Top 100 Global Innovator by Clarivate Analytics. The annual report highlights the most successful organizations in the world that are active in innovation through research and development, protection of their IP and the achievement of commercial success.

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TE Connectivity showcases its leadership in computing and industry standards at DesignCon 2018

HARRISBURG, Pa. – January 24, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working Group (EDSFF) have adopted TE’s Sliver internal cabled and card edge interconnects as the standardized connector solutions in their server, storage and networking designs. Sliver interconnects provide one of the most flexible, high-performance solutions in the market for making internal input/output (I/O) connections on the board.

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TE Connectivity brings breakthrough speed and density to embedded computing interconnect systems

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, in Austin, Texas to hear expert Mike Walmsley, global product manager at TE, present at the 2018 Embedded Tech Trends, on January 23 at 10:30am. TE will showcase its latest interconnect products for rugged embedded computing systems, including products built to meet OpenVPX standards. OpenVPX is rapidly evolving as a standard architecture for next generation critical embedded computing. As a result of this drive toward standardization, there is an evolution toward smaller packaging, increased functionality and faster processing. In 2018, TE will release several breakthrough products that support this evolution.

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