TE Connectivity Supports Racing Across Land, Air and Sea

Members of the media are invited to visit TE Connectivity (TE), a world leader in connectivity and sensors, to learn how TE autosport products are powering technologies in racing vehicles and beyond. Corrosion is a critical challenge to autosport performance, where every piece of technology can be the difference between winning and losing. TE has a deep history of engineering innovative solutions that address the harsh environments race teams face.

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DFI Reliable Mini-ITX Motherboard Optimized for Medical Imaging Solution

A total healthcare solution provider based in the U.S. was looking to build a MDR Video RP equipment to be integrated into their overall medical data management system that could capture detailed medical images/videos and enable real-time connectivity with the enterprise IT infrastructure. The equipment should demonstrate outstanding graphics capabilities, be able to connect to the database instantly, and conform to strict regulations imposed by government entities. Considering these requirements, DFI suggested the use our Mini-ITX HM101-QM87 motherboard to power this medical imaging device.

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AVX Releases Industry's First Cost Effective, Large Gauge, Discrete Wire-to-Board Connector Solution

AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has released the new STRIPT™ 9177-500 Series single IDC contacts for 12 - 18AWG wire-to-board terminations in harsh industrial, transportation, outdoor, and alternative energy applications. These latest additions to the STRIPT family of UL-approved, insulator-less single contacts provide users with a cost-effective solution for quickly, easily, and reliably terminating individual high-current or high-voltage solid or stranded wires onto a PCB using a proven, gas-tight contact system. Designed to support large wire gauges from both a robustness and current rating perspective, the new 9177-500 Series single IDC contacts enable UL-certified wire-to-board connections up to 15A and 600V, and are built to withstand extreme temperatures, shock, and vibration.

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24/7 Stable Performance as Tough Challenge in IoT Generation

The demand for small form factors for space-constrained embedded application is increasing rapidly. In response to this requirement, DFI gladly introduces you to ultra-small size products which includes industrial motherboards and system-on-modules based on the new generation Intel® Atom™ processor E3900 series (code name: Apollo Lake). Compared to the last generation Atom (N3700 Series), the brand new DFI product family supports harsh environments and narrow space operations with 30% higher performance and impressively optimized energy efficiency. These products are ideally designed for IoT, automation, transportation, and medical applications.

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DFI’s New Gen Intel Core Fanless and Small Industrial Computer

As more and more balance is required among high performance, small size, and ability to be fanless in the embedded markets, DFI is glad to introduce to you a brand-new option: EC70A-SU/EC70B-SU industrial box PC powered by 6th Generation Intel® Core™ i7/i5/i3 processor (code name: Skylake). This small and fanless but powerful embedded computer series supports excellent computing, -20°C to +60°C temperature range, DDR4 onboard, Mini PCIe & M.2 for Wi-Fi/LTE/mSATA, and industrial high-speed I/O interfaces (up to 2 PoE, 2 GbE, 6 COM, and 6 USB 3.0) designed for smart factory, digital healthcare, transportation, and utilities & energy applications.

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